Electronic Systems Packaging specializes in fabricating custom designed multi-layered laminated bus bar per customer specifications including IGBT’s and CNC machined copper bus bars for high current applications.

Our backplane interconnect systems offer efficient, cost-effective ways to distribute signals or power to either multiple points on a printed circuit board or throughout a system. They offer a variety of benefits to a system designer, which can simplify printed circuit board design to control impedance, minimize noise, cross-talk, eliminate wiring errors, and simplify assembly.

Electronic Systems Packaging offers a complete line of signal and power distribution products, with custom backplane interconnect systems designed specifically for your application. Standard items, such as our patented clip/strip solderless bussing systems, PCB and board stiffening bus bars, patented compliant pin, and our popular programming jumper, will help maximize your design options as well as the cost-effectiveness of your package.